JPH0715139Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH0715139Y2
JPH0715139Y2 JP1986179913U JP17991386U JPH0715139Y2 JP H0715139 Y2 JPH0715139 Y2 JP H0715139Y2 JP 1986179913 U JP1986179913 U JP 1986179913U JP 17991386 U JP17991386 U JP 17991386U JP H0715139 Y2 JPH0715139 Y2 JP H0715139Y2
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
recess
pellet
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1986179913U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6384958U (en]
Inventor
正人 相場
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1986179913U priority Critical patent/JPH0715139Y2/ja
Publication of JPS6384958U publication Critical patent/JPS6384958U/ja
Application granted granted Critical
Publication of JPH0715139Y2 publication Critical patent/JPH0715139Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1986179913U 1986-11-21 1986-11-21 半導体装置 Expired - Lifetime JPH0715139Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986179913U JPH0715139Y2 (ja) 1986-11-21 1986-11-21 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986179913U JPH0715139Y2 (ja) 1986-11-21 1986-11-21 半導体装置

Publications (2)

Publication Number Publication Date
JPS6384958U JPS6384958U (en]) 1988-06-03
JPH0715139Y2 true JPH0715139Y2 (ja) 1995-04-10

Family

ID=31123395

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986179913U Expired - Lifetime JPH0715139Y2 (ja) 1986-11-21 1986-11-21 半導体装置

Country Status (1)

Country Link
JP (1) JPH0715139Y2 (en])

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56114546U (en]) * 1980-02-04 1981-09-03
JPS6045042A (ja) * 1983-08-23 1985-03-11 Matsushita Electronics Corp 半導体パッケ−ジ

Also Published As

Publication number Publication date
JPS6384958U (en]) 1988-06-03

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